Update Hardware/readme.md

Hardware/readme.md

@@ -16,13 +16,16 @@ The implant schematics is shown Figure 1. The bill of materials for implant is g
 
 <br>We can begin with the removal of the serial connection board from [breakout board][1] to save some space. This part is marked with a scissor symbol on the back of the board. This was also marked in the [Figure below][fig.2] with a dashed line (1). After removing the serial communication PCB, we can still program the board via [over-the-air download (OAD)][1a]. You can find the instructions for the OAD in **firmware documentation**.
 
-![Hardware modification instructions figure](/Hardware/Implant/Images/Modifying_breakout.jpg)*Please cut the board from the dashed line to remove the serial connection interface*
+![Hardware modification instructions figure](/Hardware/Implant/Images/Modifying_breakout.jpg)*(1) Please cut the board from the dashed line to remove the serial connection interface*
 
 </details>
 <details>
     <summary markdown="span"><i>Setting up DC-DC regulator for MRI setting</i></summary>
 
-<br>We need to remove the smd inductor as shown in **Figure 2** because it has a ferite core, which would be saturated in MR envrionment and may damage the hardware. This inductor is needed for the DC-DC regulator of the SoC. You can continue without replacing another inductor and use the global LDO regulator. The global LDO consumes [30% more power][1b] than the default DC-DC buck converter. Instead of replacing the inductor with a air-core equvalent value, global LDO is better for the size constraints and simplicity. Please make sure that the internal DC/DC regulator is properly configured, if global LDO is used. The instructions are shown in the **firmware** section     
+<br>We need to remove the smd inductor (2) shown in the Figure below because it has a ferite core, which would be saturated in MR envrionment and may damage the hardware. This inductor is needed for the DC-DC regulator of the SoC. You can continue without replacing another inductor and use the global LDO regulator. The global LDO consumes [30% more power][1b] than the default DC-DC buck converter. Instead of replacing the inductor with a air-core equvalent value, global LDO is better for the size constraints and simplicity. Please make sure that the internal DC/DC regulator is properly configured, if global LDO is used. The instructions are shown in the **firmware** section
+
+![Hardware modification instructions figure](/Hardware/Implant/Images/Modifying_breakout.jpg)*(2) We need to desolder the ferite inductor*
+
 </details>
 <details>
     <summary markdown="span"><i>Preparing the casing </i></summary>
@@ -38,9 +41,21 @@ We need to drill two holes to the lids. The hole at front lid will be used for t
 <details>
     <summary markdown="span"><i>Setting up external antenna for MRI setting</i></summary>
 
-<br>We can configure the _2.4 GHz_ antenna for MRI setting. First, we need to remove the SMA connector from the [breakout board][1]. Then, the port of the antenna output from the board should be connected to the protection filter via an coaxial wire. The other port of the protection filter can be connected to the [external antenna][8]. Currently, there is no dedicated port in the implementation. Therefore, the connector needs to be stripped and soldered to the filter.         
+<br>We can configure the _2.4 GHz_ antenna for MRI setting. First, we need to remove the SMA connector from the [breakout board][1] as indicated with (3) in the Figure below. Then, the port of the antenna output from the board should be connected to the protection filter via an coaxial wire. The other port of the protection filter can be connected to the [external antenna][8]. Currently, there is no dedicated port in the implementation. Therefore, the connector needs to be stripped and soldered to the filter.  
+
+![Hardware modification instructions figure](/Hardware/Implant/Images/Modifying_breakout.jpg)*(3) Remove the SMA connector for the external antenna*
+
+</details>
+<details>
+    <summary markdown="span"><i>Installing the headers</i></summary>
+
+<br>Finally, we can solder the [headers][ay] to connect the breakout board to the main PCB. There is no need to solder header to the each pin. Nevertheless, the modified breakout board should look like similar to the one at the top of the Figure.      
+
+![Hardware modification instructions figure](/Hardware/Implant/Images/Modifying_breakout.jpg)*(3) Remove the SMA connector for the external antenna*
+
 </details>
 
+
 ### Bill of Materials
 
 [Table-1](#tabImp): Bill of materials of the implant
@@ -79,7 +94,7 @@ We need to drill two holes to the lids. The hole at front lid will be used for t
 
 [//]: <> (References for the figures)
 
-[fig.2]: /Hardware/Implant/Images/Modifying_breakout.jpg
+[fig.2]: /Hardware/Implant/Images/Modifying_breakout.jpg "Enlarge the Figure"
 
 [//]: <> (References for datasheets)