The implant schematics is shown Figure 1. The bill of materials for implant is given in [Table-1](#tabImp)
The implant schematics is shown Figure 1. The bill of materials for implant is given in [Table-1](#tabImp). The reasoning of the selected components is explained in the publication. Here, the instructions to build the implant is provided.
1- The BLE system on chip (SoC) is selected for its high data rate. BLEv5.x stronger physical layer (PHY) compared to BLEv4.x. Its theoretical datarate can go up to 2Mbps. The used SoC is [cc2652RB][aa] from Texas Instruments (TI). It does not require an external cyrstal oscillator, which is nice to consider when there is size constraint. Nevertheless, an open source hardware [breakout PCB][1] was used, which provides basic external smd components for chip to operate and enough external IO is available for the purpose of the project.
