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 # Hardware Documentation
 
 [[_TOC_]]
@@ -10,12 +8,11 @@ The implant schematics is shown Figure 1. The bill of materials for implant is g
 
 <details>
     <summary markdown="span"><i>Getting started with the breakout board</i></summary>
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 The BLE system on chip (SoC) is selected for its high data rate. BLEv5.x stronger physical layer (PHY) compared to BLEv4.x. Its theoretical datarate can go up to 2Mbps. The used SoC is [cc2652RB][aa] from Texas Instruments (TI). It does not require an external cyrstal oscillator, which is nice to consider when there is size constraint. Nevertheless, an open source hardware [breakout board][1] was used, which provides the basic external smd components for chip to operate. In addition, the number routed input/output pins is enough for the purpose of the project. First of all, please complete the initial programming of the chip described at the **firmware instructions** section. Then, we can start modifying the hardware components. If you do not start with the **firmware programming**, recovering the hardware after following hardware modifications requires a lot of time.
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 <details>
-    <summary markdown="span"><i>Removing unnecessary serial communication hardware</i></summary>
+    <summary markdown="span"><i>Removing serial communication hardware</i></summary>
 
 We can begin with the removal of the serial connection board from breakout board to save some space. This part is marked with a scissor symbol. After this point, we can program the board via [over-the-air download (OAD)][1a]. You can find the instructions for the OAD in **firmware documentation**.
 </details>